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 APTGF150A120T3WG
Phase leg NPT IGBT Power Module VCES = 1200V IC = 150A @ Tc = 80C
25
26
27
28
31
Application * Welding converters
4 3
13 14 15 16 NTC
8 7
18
19
20
22
32
Features * Non Punch Through (NPT) Fast IGBT - Low voltage drop - Low tail current - Switching frequency up to 50 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated * Kelvin emitter for easy drive * Very low stray inductance * High level of integration * Internal thermistor for temperature monitoring Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * Easy paralleling due to positive TC of VCEsat * RoHS compliant
28 27 26 25 29 30
23 22
20 19 18 16 15
31 32 2 3 4 7 8 10 11 12
14 13
Pins 25/26/27/28 must be shorted together Pins 13/14/15/16 must be shorted together Pins 18/19/20/22 must be shorted together
Absolute maximum ratings
Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area TC = 25C TC = 80C TC = 25C TC = 25C TJ = 150C Max ratings 1200 210 150 300 20 961 300A @ 1150V Unit V A V W
May, 2009 1-5 APTGF150A120T3WG - Rev 1
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
www.microsemi.com
APTGF150A120T3WG
All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics
Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter Saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V, VCE = 1200V Tj = 25C VGE =15V IC = 150A Tj = 125C VGE = VCE , IC = 6mA VGE = 20V, VCE = 0V Min Typ 3.2 3.9 5.5 Max 250 3.7 6.5 400 Unit A V V nA
4.5
Dynamic Characteristics
Symbol Characteristic Cies Coes Cres QG Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Isc Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Short Circuit data Test Conditions VGE = 0V VCE = 25V f = 1MHz VGE= 15V ; VCE=600V IC=150A Inductive Switching (25C) VGE = 15V VBus = 600V IC = 150A RG = 5.6 Inductive Switching (125C) VGE = 15V VBus = 600V IC = 150A RG = 5.6 VGE = 15V Tj = 125C VBus = 600V IC = 150A Tj = 125C RG = 5.6 VGE 15V ; VBus = 900V tp 10s ; Tj = 125C Min Typ 9.3 1.4 0.7 1.6 120 50 310 20 130 60 360 30 18 mJ 8 900 A Max Unit nF C
ns
ns
Reverse diode ratings and characteristics
Symbol Characteristic VRRM IRM IF VF
Maximum Peak Repetitive Reverse Voltage
Test Conditions Tj = 25C Tj = 125C Tc = 80C IF = 100A IF = 200A IF = 100A IF = 100A VR = 800V di/dt =200A/s
Min 1200
Typ
Max 100 500
Unit V A A V
May, 2009 2-5 APTGF150A120T3WG - Rev 1
Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage
VR=1200V
Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C
100 2.4 2.7 1.8 385 480 1055 5240
3
trr Qrr
Reverse Recovery Time Reverse Recovery Charge
ns nC
www.microsemi.com
APTGF150A120T3WG
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol R25 R25/R25 B25/85 B/B Characteristic Resistance @ 25C T25 = 298.15 K TC=100C
RT = R25 1 exp B25 / 85 T - T 25
T: Thermistor temperature 1 RT: Thermistor value at T
Min
Typ 50 5 3952 4
Max
Unit k % K %
Thermal and package characteristics
Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case thermal resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode 2500 -40 -40 -40 2.5 Min Typ Max 0.13 0.55 150 125 100 4.7 110 Unit C/W V C N.m g
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
To heatsink
M4
SP3 Package outline (dimensions in mm)
1
12
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
www.microsemi.com
3-5
APTGF150A120T3WG - Rev 1
May, 2009
17
28
APTGF150A120T3WG
Typical Performance Curve
Output Characteristics (VGE=15V) Output Characteristics 300 250 200 IC (A)
VGE=12V TJ = 125C VGE=20V VGE=15V
300 250
IC (A)
TJ=25C
200 150 100 50 0 0 1 2 3 VCE (V) 4 5 6
TJ=125C
150 100 50 0 0 1 2 3 4 VCE (V) 5 6
VGE=9V
*
300 250 200
Transfert Characteristics 56 48 40 E (mJ)
TJ=125C
Energy losses vs Collector Current
VCE = 600V VGE = 15V RG = 5.6 TJ = 125C
Eon
IC (A)
150 100 50 0 5 6 7
32 24 16
Eoff
TJ=25C
8 0 0 50 100 150 IC (A) Reverse Bias Safe Operating Area 350 300 200 250 300
8
9
10
11
12
VGE (V) Switching Energy Losses vs Gate Resistance 80
VCE = 600V VGE =15V IC = 150A TJ = 125C
60 E (mJ)
Eon
250 IC (A) 200 150 100
VGE=15V TJ=125C RG=5.6
40
20
Eoff
50 0 0
0 0 5 10 15 20 25 30 35 40 45 50 Gate Resistance (ohms)
300
600
900
1200
1500
VCE (V)
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.14 Thermal Impedance (C/W) 0.12 0.1 0.08 0.06 0.04 0.02 0.1 0.05 0.0001 0.001 0.01 0.1 1 10 Single Pulse 0.9
0.5 0.3
0 0.00001
rectangular Pulse Duration (Seconds)
www.microsemi.com
4-5
APTGF150A120T3WG - Rev 1
May, 2009
0.7
IGBT
APTGF150A120T3WG
Operating Frequency vs Collector Current Fmax, Operating Frequency (kHz) 100 80
ZVS VCE=600V D=50% RG=5.6 TJ=125C TC=75C
Forward Characteristic of diode 200
150 IF (A)
TJ=125C
60
ZCS
100
TJ=25C
40 20 0 0 40 80 IC (A) 120 160 200
hard switching
50
0 0.0 0.5 1.0 1.5 2.0 VF (V) 2.5 3.0
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.6 Thermal Impedance (C/W) 0.5 0.4 0.3 0.2 0.1 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse
Diode
0 0.00001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
www.microsemi.com
5-5
APTGF150A120T3WG - Rev 1
May, 2009


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